Klerex

DELO supplies a great variety of light-curing and UV-curing epoxy resins. The product range includes adhesives for complex automotive and optoelectronic applications, chip encapsulants for fast in-line processes (Dam&Fill), encapsulants with a high water barrier effect for organic electronics, and many more. Thanks to their high transparency and their thermal stability, the materials can also be used in the production of optical components. Further important properties include low shrinkage during polymerization, low outgassing, good chemical resistance, and high ion purity. The special feature of DELO’s products is that they can be preactivated. Therefore, it is also possible to use DELO KATIOBOND® to bond opaque materials.

In the production of smart card modules, a “Dam” of a high-viscous DELO KATIOBOND® encapsulant is dispensed around the chip. Afterwards, the low-viscous “Fill” compound is dispensed within the “Dam”. This is to ensure a minimum encapsulation height and to protect the chip.

 

In order to make sure that the readers are fully functioning even at elevated temperatures, and high humidity or dryness, the displays must be sealed by adhesive. Especially for this purpose, DELO has developed a range of adhesives with low permeation and disparate flexibilities adjusted to the specific application. The adhesives’ special feature is that they cannot only be UV-cured. If necessary they can also be cured by exposure to visible light, for example if the adhesive is supposed to be cured through UV-blocked foils.

In the “active alignment” process, optical components such as mirrors, lenses or prisms are aligned while being fixed to a substrate. The adhesive must remain liquid as long as alignment has not been completed. However, as soon as the component is in the correct position, the adhesive must cure very quickly. DELO has developed special DELO KATIOBOND® adhesives for this requirement. They give low outgassing, cure very quickly after fixing, and are characterized by low water absorption and low shrinkage. In addition, they retain their properties while and after being subject to temperature stress. Adhesives for LED packaging.

Properties

•  Activation within seconds for short cycle times in production
•  Suitable for opaque materials
•  Wide temperature range of use

Further application areas

Electronics | Organic electronics

Products

DELO KATIOBOND® 45952
DELO KATIOBOND® 4670
DELO KATIOBOND® DF698
DELO KATIOBOND® EG6133
DELO KATIOBOND® GE680
DELO KATIOBOND® KB552
DELO KATIOBOND® OM6605